SK hynix Breaks Ground on $4 Billion HBM Packaging Fab in West Lafayette, Indiana

SK hynix held a groundbreaking ceremony on August 27 for its advanced packaging production facility for AI memory in West Lafayette, Indiana, its first High Bandwidth Memory (HBM) production base in the United States.

Over $4 billion investment

The Indiana fab, with a total expected investment of more than $4 billion, is scheduled to open its cleanroom by October 2028 and begin mass production of next-generation HBM in the second half of 2029. It is expected to employ approximately 1,000 people during commercial operations.

Made in USA HBM

Wafers produced in Korea will be shipped to Indiana for advanced packaging and testing before products are supplied to U.S. customers. An Advanced Packaging R&D Testbed will be built alongside the production lines.

Jobs and suppliers

More than 100 companies are being considered as suppliers, and SK hynix plans to create approximately 7,000 direct and indirect jobs during construction and operations. The company also signed an MOU with Purdue University for advanced packaging R&D.

Indiana Governor Mike Braun said:

“This project will usher in the next generation of American innovation, bring thousands of good-paying jobs to Indiana and supercharge regional economic development.”

U.S. Senator Todd Young said:

“SK hynix’s historic investment in West Lafayette is further proof that Indiana is leading the way in rebuilding America’s semiconductor industry.”