TSMC Adds $100 Billion for Four More Arizona Fabs, Raising U.S. Investment to $265 Billion

The White House and the Department of Commerce announced on July 16 an incremental $100 billion investment by TSMC for advanced semiconductor manufacturing and packaging facilities in Arizona, bringing the company’s total planned U.S. investment to a record $265 billion.

Four more fabs

The new investment will fund four additional advanced fabs at 2 nanometers or more advanced, bringing TSMC’s planned U.S. footprint to 12 leading-edge semiconductor and packaging facilities.

30% of leading-edge capacity in Arizona

According to the City of Phoenix, around 30% of TSMC’s 2-nanometer and more advanced capacity will be located in Arizona once the announced fabs are complete. TSMC’s first Arizona fab has been in volume production of N4 technology since late 2024, and construction of its second fab, using 3-nanometer technology, is complete, with volume production expected in 2027. TSMC Arizona employs more than 3,500 people.

Building on earlier pledges

The announcement follows TSMC’s March 2025 commitment to expand its original $65 billion investment by an additional $100 billion.

Dr. C.C. Wei, TSMC Chairman and CEO said:

“This is to support the strong multi-year demand from our leading U.S. customers, and we believe this investment will further foster the development of the U.S. semiconductor ecosystem, strengthen the supply chain, and support significant job creation in the United States.”

Arizona Governor Katie Hobbs said:

“TSMC’s historic investment firmly establishes Arizona as the nation’s epicenter for advanced semiconductor manufacturing and innovation.”