TTM Technologies Opens $130 Million Ultra-HDI Circuit Board Facility in DeWitt, New York

TTM Technologies celebrated on June 22 the ribbon-cutting and grand opening of its new Ultra-High-Density Interconnect (Ultra-HDI) printed circuit board manufacturing facility, Syracuse Diamond, in DeWitt, New York.

215,000 square feet

The facility spans 215,000 square feet on TTM’s existing Syracuse campus and is among the first in the nation purpose-built for Ultra-HDI PCB and advanced packaging production for aerospace and defense programs, including radar, missile defense, space-based sensors and autonomous systems.

$130 million and 400 jobs

The $130 million investment includes $30 million from the U.S. Department of War. It will create up to 400 new engineering and manufacturing jobs, bringing TTM’s Central New York workforce to approximately 1,000. The project was first announced in November 2023.

Cathie Gridley, EVP and President of Aerospace & Defense at TTM Technologies said:

“This is more than a facility — it is a statement about where American defense manufacturing is headed. Our defense customers need trusted, domestic, ultra-high-density interconnect production capability that meets the most demanding program requirements in the world. Today, we bring that capability to the United States.”